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  • MEMS Sensors for Automotive and Aerospace Markets | Micralyne
    Values Testimonials Contact Us Design Resource Library News Releases Careers Inertial Sensors BioMed MEMS Micro Needles Molecular Diagnostic Assays Microfluidic Chips Optical MEMS Silicon Optical Benches Mirror Arrays Actuation Spatial Light Valve Industrial Sensors Pressure Sensors Inertial Sensors Gas Detection Microfabrication Pressure Sensors Inertial Sensors Gas Detection Inertial sensors are used to measure physical movement like thrust velocity angle and direction widely used in consumer applications like smart phones game consoles automotive air bag deployments and GPS displays However the greater Inertial Sensor market includes oil and gas exploration geological survey equipment medical devices and aerospace Regardless of application MEMS based inertial sensors require complex and precise etch techniques to create fine geometries that are consistent across the wafer Micralyne Advantage We focus on providing customers with application specific design solutions for precision sensitivity and speed Our extensive experience and track record in application specific solutions gives us a vast toolbox of capabilities to provide spec compliant manufacturing ready and cost effective Sensors for any application Our Common Process elements include Dry Etch DRIE RIE Metal Deposition Thin Film Deposition Wafer Bonding SOI Wafer Processing Next Steps Stop spinning in circles and start working with Micralyne Contact Us Are you

    Original URL path: http://www.micralyne.com/applications/industrial-sensors/inertial-sensors/ (2016-04-27)
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  • MEMS Sensors for Gas Market | Micralyne
    Resource Library News Releases Careers Gas Detection BioMed MEMS Micro Needles Molecular Diagnostic Assays Microfluidic Chips Optical MEMS Silicon Optical Benches Mirror Arrays Actuation Spatial Light Valve Industrial Sensors Pressure Sensors Inertial Sensors Gas Detection Microfabrication Pressure Sensors Inertial Sensors Gas Detection Market demand for accurate and cost effective gas sensing devices continues to grow The wide variety of gas sensing applications are largely driven by health and safety considerations biological research industrial control devices and other diverse use cases Several MEMS capabilities developed over time by Micralyne strongly benefit the methods and systems used for sensing many gases including argon carbon dioxide methane nitrogen dioxide oxygen sulphur dioxide Micralyne Advantage From business and IP strategy to final product Micralyne consults and collaborates with customers to develop and manufacture robust gas sensors that are stable over time and meet the stringent drift specifications required by industrial and medical applications Most processes required for gas sensors take advantage of a wide set of metal and alloy deposition capabilities of Micralyne Our experience includes manufacturing gas sensors with optical and IR sensing mechanisms and several specialized metal and chemical coatings Next Steps Gather more information about Micralyne s gas sensor manufacturing capability

    Original URL path: http://www.micralyne.com/applications/industrial-sensors/gas-detection/ (2016-04-27)
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  • Microfabrication | Micralyne
    Chips Optical MEMS Silicon Optical Benches Mirror Arrays Actuation Spatial Light Valve Industrial Sensors Pressure Sensors Inertial Sensors Gas Detection Microfabrication Microfabrication is best described as the foundation technology and platform for creating micro systems While not technically MEMS Microfabrication techniques are borrowed from MEMS processes and provide fixed micro structures and assemblies that serve a wide range of functions and applications Examples of Microfabrication can be found in products like miniature connectors in smart phones micro assemblies for medical devices and precision industrial tooling Engineering a micro fabricated device requires a myriad of decisions regarding materials techniques and process steps and require an experienced team Whether the immediate need is for proof of concept process definition or process transfer partnering with the right Micro fabrication provider is a strategic decision that contributes significantly to competitive advantage and a company s bottom line Micralyne Advantage Microfabrication has been a key capability at Micralyne from Company inception Over 350 companies have capitalized on the full range of our value added services and elegant solutions from that over 350 companies Our Process Technology team and talented technicians have a hearty appetite for innovation Our collaborative business model and our state of the art 55 000 square foot facility in Edmonton Alberta Canada makes us an ideal Microfabrication partner Among the many elements contributing to the high quality of our microfabrication processes and solutions are ISO 9001 2008 Compliant ISO 13485 Compliant Clean Room Certificate of Performance Real Time online Statistical Process Control SPC Real Time Monitoring of Material Movement Inventory Control In Our Manufacturing Execution System MES Micro Contamination ESD Control Programs Compliant With ANSI Regulations Failure Analysis Services RoHS Compliant Key process capabilities Dry Wet Etch Metal Deposition Chemical Vapor Deposition Plating Wafer Grind Polish Wafer Bonding Next Steps For an

    Original URL path: http://www.micralyne.com/applications/microfabrication/ (2016-04-27)
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  • MEMS Technology Platforms (MMTP) | Micralyne
    Contact Us Design Resource Library News Releases Careers Micralyne MEMS Technology Platforms MMTP MicraGEM Si SOI MEMS Process MicraSilQ Wafer Level Packaging Platform Through Silicon Via Reduce Development Costs and Accelerate Time to Market Micralyne s MEMS Technology Platforms provide a modular approach to MEMS design and enable a semi custom device implementation By standardizing specific process steps and structures Micralyne reduces the need to create a new process for each design Customers control the technical content and specify the device structure functionality size and characteristics We provide standard flows to implement items like SOI Processes Wafer Level Packaging WLP and Through Silicon Vias TSV Micralyne Advantage MMTP enables customers to accelerate the development of new products with our Technology Platforms Our Customers derive the benefits of Lower Development Costs Shorter Development Time Project Risk Reduction Customers benefit from the extensively tested pre characterization and validated process flows in place at Micralyne allowing customers rapidly start and fast track design projects savings months of engineering time The MicraGEM Si platform is a unique offering to our MEMS clients This partnership with Micralyne ensures both a seamless path from design confirmation to volume manufacturing for industrial R D and research access

    Original URL path: http://www.micralyne.com/technology-platforms/ (2016-04-27)
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  • MicraGEM-Si™ – SOI MEMS Process | Micralyne
    reducing the initial cost and risk of development and speeding the time to market for MEMS based devices We offer this unique silicon MEMS process to our clients through two different pathways for researchers and prototype designers we work in collaboration with CMC Microsystems to allow designers to purchase a portion of a MEMS fabrication run through use of a multi product wafer strategy CMC Microsystems engages with the client provides design documentation and design consolidation services for MicraGEM Si for companies with larger volume requirements Micralyne will provide this platform directly to company clients who require a full fabrication run or who require customization of the technology The platform consists of an SOI silicon on insulator base wafer with customer defined cavities support posts and electrical wiring A top SOI wafer with optional cavities is then fusion bonded to the base wafer The handle wafer is removed leaving a precise thickness MEMS device layer A patterned metal layer is added for high reflectivity circuit routing and wire bonding The top side of the wafer can be patterned and etched to release the MEMS devices Micralyne s unique process capability provides high yield wafer bonding after several masks of pattern

    Original URL path: http://www.micralyne.com/technology-platforms/micragem-si/ (2016-04-27)
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  • MicraSilQ Wafer Level Packaging Platform | Micralyne
    Engagement Checklist Our Location Our Company Leadership Team Board Members Corporate Values Testimonials Contact Us Design Resource Library News Releases Careers MicraSilQ Wafer Level Packaging Platform MicraGEM Si SOI MEMS Process MicraSilQ Wafer Level Packaging Platform Through Silicon Via MicraSilQ Micra silk wafer level packaging WLP process platform for MEMS devices provides an all in one customer solution integrating wafer level fabrication hermetic packaging and through silicon via TSV architecture The MicraSilQ established design kit reduces initial development cost ultimate manufacturing component cost footprint thickness and weight while simultaneously providing improved electrical performance reliability and extensibility into 3D IC designs MicraSilQ can be used for a variety of inertial sensors Features include Insulated Through Silicon Vias TSV polysilicon filled Thick silicon device layer 60 microns standard for high comb finger capacitance Lead free solder ball grid array Wafer level bonding processes optimized for getter film activation and hermetic sealing MicraSilQ is proven cost effective solution for applications requiring high accuracy low noise mechanical sensing for devices operating across wide frequency ranges and for components requiring high vacuum encapsulation Next Steps Ready to Design Request our MicraSilQ Wafer Level Packaging Design Kit to learn more Fill Out Form to Download Ready

    Original URL path: http://www.micralyne.com/technology-platforms/micrasilq/ (2016-04-27)
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  • Through Silicon Via - TSV Technology | Micralyne
    Etching Thin Film Deposition Wafer Processing Packaging Assembly Manufacturing Systems Quality Assurance MEMS Testing Characterization Transfer to Manufacturing Working With Us Engagement Checklist Our Location Our Company Leadership Team Board Members Corporate Values Testimonials Contact Us Design Resource Library News Releases Careers Through Silicon Via MicraGEM Si SOI MEMS Process MicraSilQ Wafer Level Packaging Platform Through Silicon Via Through Silicon Via TSV allows electrical connections to be formed through a silicon wafer or multi wafer devices Electrical connections through a silicon wafer reduce die footprints and allow interlayer connectivity When combined with Wafer Level Packaging WLP TSVs minimize die size allow conventional or flip chip bonding and help minimize assembly cost of the final device Micralyne offers polysilicon TSV technology for custom prototyping and manufacturing Connections between layers are created through etching via holes selectively insulation and fill in with conductive polysilicon This platform includes deep etched silicon trenches isolation or grounding vias polysilicon filling and the option for integration in SOI wafer stacks Customers provide TSV requirements including aspect ratio thickness pitch resistivity capacitance geometry and isolation resistance Ready to discuss project needs Call us on 1 780 431 4400 or email us at sales micralyne com Facebook Linkedin

    Original URL path: http://www.micralyne.com/technology-platforms/through-silicon-via/ (2016-04-27)
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  • Fabrication Facility and Capabilities | Micralyne
    expertise is the ability to define and optimize manufacturing processes for MEMS and Microfabricated devices Our design teams guide customers from initial proof of concept through process definition and integration to standard production in an organized and structured flow Benefit to customers is a manufacturing flow that is robust efficient and scalable Micralyne s primary manufacturing location is a 55 000 ft 2 facility in Edmonton Alberta Canada The Clean facility is state of the art offering wafer fabrication lines assembly and test quality assurance and advanced device metrology Specific process capabilities we provide include photolithography wet and dry etching thin film deposition wafer bonding dicing as well as packaging assembly test and characterization Micralyne fabricates structures or films on a variety of substrates Silicon 6 wafers Standard Single and Double SOI Epitaxial Glass Borofloat 0211 Quartz Pyrex Fused Silica Sapphire Miscellaneous Alumina Piezoelectric Crystals Ceramic Diamond Aluminum Nitride Micralyne Advantage We blend experts with strong MEMS applications knowledge together with process performance champions to design process flows for robust cost effective fabrication to match customer requirements Our project teams strive for deep insights to their customers needs and close communications throughout the relationship Photo Lithography Etching Thin Film Deposition

    Original URL path: http://www.micralyne.com/fabrication-capabilities/ (2016-04-27)
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