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  • Photo Lithography | Micralyne
    Processing Packaging Assembly Virtually all MEMS and Micro fabricated devices start with a pattern on the wafer to perform a variety of physical and chemical processes on the substrate This patterning is used to selectively isolate certain areas of the die for deposition etching doping and other activities The primary method used to create the pattern is Photolithography Micralyne uses both contact aligners and steppers to provide various Photolithography capabilities Expose ASML PAS 5500 60B I line 5X reduction stepper Submicron resolution 0 45um Single machine overlay 90nm 3 sigma 3 to 8 fully automatic tool 55 wafers hour throughput 6 UDOF 1um 0 45um with NA 0 54 CD uniformity 60nm 3 sigma Minimum features 0 5 µm Contact Aligner 1 1 Minimum features 1 µm vacuum contact mode 3 µm proximity mode Alignment accuracy 1 µm front side align 3 µm front to back side align CD uniformity 0 1 µm 1 sigma Coat Develop YES HMDS vapor prime oven Automated SVG 8600 coat develop tracks 4 6 transparent wafer compatible Positive resists thickness 1 15um Thickness uniformity control down to 1 for thin resist Puddle spray develop with developer chemical temperature control Stand alone Solitec coat develop

    Original URL path: http://www.micralyne.com/fabrication-capabilities/photo-lithography/ (2016-04-27)
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  • Etching - DRIE, RIE & Wet etching | Micralyne
    Releases Careers Etching Photo Lithography Etching Thin Film Deposition Wafer Processing Packaging Assembly Etch processes are fundamental to MEMS and Micro fabrication Micralyne s Development team has broad experience in numerous selective etch techniques in both dry and wet processes DRIE Deep Reactive Ion Etch High aspect ratio up to 50 1 aspect ratio sidewall angle 89 5 to 89 8 degrees and etch rate up to 16 µm min etch depths 1µm to 1000µm Positive profile and isotropic etching Proven processes for heat sensitive membrane or mirror release etch Extensive experience with through wafer etches Vacuum tape bonding for through wafer etches RIE Reactive Ion Etch Silicon quartz oxide nitride polysilicon oxynitride Ti TiW Nb Wafer edge protection for KOH TMAH mask etch layers Deep trench oxide etch for removal of oxide at bottom of silicon trenches up to 10 1 aspect ratio Wet etching metal glass Silicon isotropic etching depth control of target 3 µm Glass isotropic etching from 0 4 µm to 300 µm depth control of 0 2 µm on a 16 µm etch glass CD 90 µm 3 µm HF oxide sacrificial etch Lift off Thin film etching metals and dielectrics Standard wet cleaning processes

    Original URL path: http://www.micralyne.com/fabrication-capabilities/etching/ (2016-04-27)
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  • Thin Film Deposition | Micralyne
    microns for conduction layers Patterning is done to match customer specifications using wet chemical etch or liftoff techniques Sputtering Specifications Substrates Coated Silicon SOI Glass Quartz Sapphire Diamond AlN Alumina Other Conductive Layers Gold Au Copper Cu Aluminum Al Barrier Layers Titanium Tungsten TiW Platinum Pt Molybdenum Mo Nickel Copper NiCu Other Sputtering Adhesion Layers Chromium Cr Titanium Ti Titanium Tungsten TiW Other Resistive Layers Tantalum Nitride TaN Electroplating Au AuSn 10 40 Sn wt GLAD Nano Engineered Thin Films GLancing Angle Deposition GLAD for the creation of GLAD thin films combines physical vapor deposition with computer controlled substrate motion to create GLAD nano thin films with engineered nanostructures These nanostructures can be engineered with features such as film thickness porosity and geometry Developed using patented technologies at the University of Alberta Glancing Angle Deposition broadens your choice of materials Potential applications of GLAD thin films include High surface electrodes Chromatographic media for separations Solar cells Structural alignment LCOS SERS Biosensors for medical diagnostics Humidity sensor Photonic crystals Depending on your needs GLAD thin films can be engineered to create unique properties for Light manipulation Molecular manipulation Mechanical response Electronic field manipulation Protective properties Chemical and electrochemical interaction Accessible surface area Micralyne Proprietary GLAD Technology With 10 years of development expertise Micralyne offers its proprietary GLAD deposition of nano thin films giving you established patent protection A variety of post processing techniques such as functionalization template inversion and electroplating are available Film thicknesses range from 100 s of nm to 10 s of m GLAD thin film is available at early stage development through to volume manufacturing This technology can be combined with MEMS processing and MEMS packaging techniques CVD PECVD Oxide uniformity 5 thickness 100A 7µm good stress control PECVD Nitride LF HF uniformity 5 stress control 50MPa PECVD

    Original URL path: http://www.micralyne.com/fabrication-capabilities/thin-film-deposition/ (2016-04-27)
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  • Wafer Processing | Micralyne
    With Us Engagement Checklist Our Location Our Company Leadership Team Board Members Corporate Values Testimonials Contact Us Design Resource Library News Releases Careers Wafer Processing Photo Lithography Etching Thin Film Deposition Wafer Processing Packaging Assembly Micralyne provides a variety of capabilities for Back end Wafer Processing We provide wafer services for common materials such as silicon glass and quartz as well as the exotic substrates like alumina sapphire diamond and AlN Micralyne also offers a variety of wafer bonding techniques for creating multi wafer stacks and wafer level packaging Other back end capabilities include wafer grind and polish wafer saw and dicing Wafer Bonding Aligned bonding 3 µm bond accuracy Bonding can be performed in a controlled environment vacuum capability of 5 5e 5 mbar maximum tool force is 20kN Anodic Bonding Silicon Pyrex Fusion Bonding Glass Glass Silicon Silicon Silicon Oxide Eutectic Bonding AuSn AuSi Dicing Conventional diamond blade dicing for silicon or glass single double or triple stack silicon glass stack and ceramic Standard silicon dicing 4 6 Standard glass dicing up to 6 Stealth laser dicing Silicon wafer grinding 0 5 µm Chemical mechanical polish Si and SiO2 Wafer laser coring Quartz dicing Alumina dicing Ready to

    Original URL path: http://www.micralyne.com/fabrication-capabilities/wafer-processing/ (2016-04-27)
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  • Packaging & Assembly | Micralyne
    Assembly Micralyne provides a wide range of technologies to assemble and package customer and application specific products From Bio analysis to Commercial Printing to Optical sub assemblies Micralyne has the expertise experience and tool sets to successfully for most MEMS based sub assemblies and assemblies MEMS assembly capabilities include Discrete die level packaging Spot welder High vacuum furnace for getter activation and hermetic package sealing Semi automated die sorter Die flip chip bonder Low temperature co fired ceramics Solder die attach Die Level Packaging Micralyne performs both traditional and novel Die Level Packaging for MEMS devices Expertise includes wire bonding to external packages hermetic sealing of packages using various bonding methods and Die level electrical testing of devices in low noise environment Wafer Level Micralyne s µSilQ reduces the footprint of physical die and allows electrical connections to be formed inside the die cavity LEARN MORE Wire Bonding High Speed Automated wedge wire Aluminum Gold deep access Automated ball wire Au bonding Wire bonding from die to submount die to package submount to flex cables Wire bonding equipped with PRS Wire size capability from 17 75 microns Substrate size up to 200 mm X 150 mm Position repeatability 3 microns

    Original URL path: http://www.micralyne.com/fabrication-capabilities/packaging-assembly/ (2016-04-27)
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  • Manufacturing Systems | Micralyne
    Packaging Assembly Manufacturing Systems Quality Assurance MEMS Testing Characterization Transfer to Manufacturing Working With Us Engagement Checklist Our Location Our Company Leadership Team Board Members Corporate Values Testimonials Contact Us Design Resource Library News Releases Careers Manufacturing Systems Quality Assurance MEMS Testing Characterization Transfer to Manufacturing Micralyne employs a set of proven Manufacturing Management and Information systems in an integrated framework They include carefully controlled groups of activities documented work practices and approaches to manage our manufacturing and product delivery environment and activities effectively The systems provide a smooth transition from development into volume production and maintain the ongoing quality of our production and specification compliance Our Manufacturing Systems fully integrate Quality Assurance Test and Characterization and Transfer to Manufacturing Micralyne is an ISO9001 certified supplier Micralyne Advantage With Micralyne transfer to manufacturing roadblocks cost reductions and quality improvement strategies are identified early in the process accelerating time to market for our customers Next Steps Micralyne would like to better understand your requirements for volume manufacturing Contact Us Ready to select a manufacturing partner Here is a description of the typical engagement Learn More Ready to discuss project needs Call us on 1 780 431 4400 or email us at

    Original URL path: http://www.micralyne.com/manufacturing-systems/ (2016-04-27)
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  • Quality Assurance | Micralyne
    from Design through Delivery is our objective in every customer engagement We understand that the quality of the MEMS device we supply drives the quality of the customer s end product We maintain a world class Quality Management System that has been and continues to be externally validated by clients in the Automotive Communications Energy and Life Sciences industries with some of the most stringent MEMS manufacturing requirements in the world It all starts with the Micralyne Product Quality Planning MPQP framework a structured approach which follows standard Total Quality Management TQM and Six Sigma quality improvement practices How do you know you re getting consistent quality We maintain certification and rigorous compliance to ISO Quality Management System standards and apply them to every manufacturing process we undertake The company also has specific manufacturing quality metrics to guide Engineering staff and to ensures critical design decisions are made with quality in mind We also screen our materials and services suppliers before approving them as certified vendors Vendors are gauged on delivery cost responsiveness and conformance to quality and as appropriate are required to submit Audit of Facility Certificate of Conformance Certificate of Analysis Micralyne s Quality Objective To deliver product according to or exceeding customer requirements 100 percent of the time and continually improve the effectiveness of the quality system Meeting this objective is critical to the success of the customer relationship and the integrity of everything we produce Our goals serving this objective are to achieve Outstanding customer feedback No product returns On time delivery Customers repeatedly have commended the Quality Management System in place at Micralyne However we continuously improve our systems to raise the benchmark for quality and reliability in MEMS fabrication Some of the highlights of our commitment to MEMS quality management include ISO 9001 2008

    Original URL path: http://www.micralyne.com/manufacturing-systems/quality-assurance/ (2016-04-27)
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  • MEMS Testing & Characterization | Micralyne
    Photo Lithography Etching Thin Film Deposition Wafer Processing Packaging Assembly Manufacturing Systems Quality Assurance MEMS Testing Characterization Transfer to Manufacturing Working With Us Engagement Checklist Our Location Our Company Leadership Team Board Members Corporate Values Testimonials Contact Us Design Resource Library News Releases Careers MEMS Testing Characterization Quality Assurance MEMS Testing Characterization Transfer to Manufacturing Micralyne provides custom configuration of MEMS product assemblies and implements custom testing systems unique to each customer We also offer in house process engineering services for the development and improvement of MEMS assembly and test processes This maximizes yields and efficiency giving you a lower cost product while maintaining consistent targeted quality MEMS Test Characterization Capabilities SEM Scanning Electron Microscope with x ray analysis Thin film stress measurement with thermal cycling capability Line width measurement Sheet resistance measurement Optical profiler using white light interferometry Surface profilers Film thickness measurements Cyclic Voltammetry measurements Wire bond pull testing Electrical test probe stations Automated visual inspection Real time measure and data acquisition Contact us to learn more about our MEMS test and characterization capabilities Ready to discuss project needs Call us on 1 780 431 4400 or email us at sales micralyne com Facebook Linkedin Twitter Top Search

    Original URL path: http://www.micralyne.com/manufacturing-systems/mems-test-characterization/ (2016-04-27)
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