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  • Testimonials | Micralyne
    are targeted to give its customers a unique and strategic advantage over their rivals Working together teams of Micralyne and customer representatives ensure that projects flow successfully from concept to commercialization While many of Micralyne s customers prefer to remain anonymous in the interest of maintaining their competitive edge here are a few comments and feedback from the company archives IDEX Health Science LLC Micralyne impressed us with their collaborative and methodical approach to problem solving We have been impressed with the work that Micralyne has done on our project Their extensive experience in microfluidics from design and modeling through to device fabrication was key to choosing Micralyne as our partner They impressed us with their collaborative and methodical approach to problem solving which was critical to the success of our devices Keith Andrews Director of Operations IDEX Health Science LLC Home of Upchurch Scientific Products www idex hs com U S Genomics Microfluidics Customer High quality fabrication and on time delivery U S Genomics technology stretches long DNA molecules in microfluidic chips to detect pathogens In both biosensing and human infectious disease applications we know we can rely on Micralyne for high quality fabrication and on time delivery John Harris VP Engineering U S Genomics www usgenomics com MicroCHIPS Life Sciences Customer Capability and experience to produce quality product at low and high volumes Micralyne customers range from Fortune 500 to fabless device companies It is a challenge to find a foundry having the experience of an OEM manufacturer and the willingness to work with a medical company during product development when volumes are low Micralyne has the capability and experience to produce quality product at both low and high volumes John Santini President and Chief Scientific Officer MicroCHIPS www mchips com Kavlico Transportation Customer Well established quality assurance

    Original URL path: http://www.micralyne.com/our-company/testimonials/ (2016-04-27)
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  • Contact Us | Micralyne
    Wafer Processing Packaging Assembly Manufacturing Systems Quality Assurance MEMS Testing Characterization Transfer to Manufacturing Working With Us Engagement Checklist Our Location Our Company Leadership Team Board Members Corporate Values Testimonials Contact Us Design Resource Library News Releases Careers Contact Us Head Office Micralyne Inc 1911 94 Street Edmonton Alberta Canada T6N 1E6 Phone 780 431 4400 Fax 780 431 4422 Sales Contact Information Paul Pickering VP Sales Marketing paulp micralyne com Dan Djukich Director of Business Development dand micralyne com 1 780 431 4402 Rick Brommeland Director of Sales rickb micralyne com 1 780 431 4407 Lynn Getzinger Sales Associate lynn micralyne com 1 780 431 4406 Ask a Micralyne representative to contact you We aim at opportunities which would lead to potential volume manufacturing We encourage you to call or complete the form below if you would like to learn more about Micralyne and how we can meet your development and manufacturing needs First Name Last Name Email Address Phone Number Company Preferred Contact Method Select Method Phone Email Comment Questions Continue Other Information Data Sheet Downloads Order Forms Careers with Micralyne Follow us on Twitter For General Foundry Inquiries please call 1 780 431 4400 press 1 for

    Original URL path: http://www.micralyne.com/contact/ (2016-04-27)
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  • Plans for Growth and Key Leadership Roles | Micralyne
    and CEO and the Micralyne Board of Directors to develop the strategies and implementation programs for serving customers creating high performance MEMS technology based solutions and to deliver differentiated value added custom design and manufacturing services Mr Pickering brings a 30 year career as a sales and marketing semiconductor professional Prior to joining Micralyne Pickering was VP of Worldwide Sales for Innovative Micro Technology based in California He has led global sales and marketing organizations for multiple public semiconductor manufacturers as well as numerous technology start up companies Pickering has more than 18 years of corporate executive experience in sales and marketing He is a recognized speaker at technology conferences and trade events in the Semiconductor and MEMS industries Paul is a graduate of West Chester University of Pennsylvania Concurrent with Paul Pickering s appointment Collin Twanow will become VP of Engineering for Micralyne Mr Twanow is a fifteen year veteran of Micralyne and has provided a broad contribution to Micralyne in various roles including his most recent role as VP of Sales and Marketing This change will allow Collin to focus on client technical engagements and lead the expanded development engineering team Twanow is a Professional Engineer and holds a B Sc in Engineering Physics as well as an Electrical Engineering M Eng degree with a specialization in Microfabrication Collin has also lectured on microfabrication topics at the University of Alberta Paul and Collin will both report to Mike Ciprick President and CEO of Micralyne along with Yan Qi who continues to be the VP of Operations I am thrilled about the opportunities ahead in the MEMS business and the potential to expand our business and partnerships to serve our current and new customers in growing markets We are excited to have Paul on board to lead our customer

    Original URL path: http://www.micralyne.com/news/micralyne-announces-plans-for-growth-and-key-leadership-roles/ (2016-04-27)
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  • Sitemap | Micralyne
    MEMS Micro Needles Molecular Diagnostic Assays Microfluidic Chips Optical MEMS Silicon Optical Benches Mirror Arrays Actuation Spatial Light Valve Industrial Sensors Pressure Sensors Inertial Sensors Gas Detection Microfabrication Technology Platforms MicraGEM Si SOI MEMS Process MicraSilQ Wafer Level Packaging Platform Through Silicon Via Fabrication Capabilities Photo Lithography Etching Thin Film Deposition Wafer Processing Packaging Assembly Manufacturing Systems Quality Assurance MEMS Testing Characterization Transfer to Manufacturing Working With Us Engagement Checklist

    Original URL path: http://www.micralyne.com/sitemap/ (2016-04-27)
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  • Design Resource Library | Micralyne
    Level Packaging Platform Through Silicon Via Fabrication Capabilities Photo Lithography Etching Thin Film Deposition Wafer Processing Packaging Assembly Manufacturing Systems Quality Assurance MEMS Testing Characterization Transfer to Manufacturing Working With Us Engagement Checklist Our Location Our Company Leadership Team Board Members Corporate Values Testimonials Contact Us Design Resource Library News Releases Careers Design Resource Library Data Sheets Order Forms At Micralyne we believe in giving our customers the information they need The following data sheets contain information about Micralyne and our MEMS technology To better serve you we ask that you take a moment to complete the following form in order to download our various data sheets If you do not find the information you need here please contact us First Name Last Name Email Address Phone Number Company Referred By Data Sheet Downloads MicraGem Si Micralyne Overview MEMS Optical Components Silicon Optical Bench Thin Film Metallization Systems Plated Au Sn Solder Spatial Light Value Advanced MEMS Platform for Optical Networks Comment Questions Be Contacted By Rep Continue Ready to discuss project needs Call us on 1 780 431 4400 or email us at sales micralyne com Facebook Linkedin Twitter Top Search Terms MEMS Foundry MEMS Mirror MEMS Sensors Micromaching

    Original URL path: http://www.micralyne.com/design-resource-library/#wpcf7-f457-p31-o1 (2016-04-27)
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  • Silicon MEMS Platform | Micralyne
    of complex micro electro mechanical systems MEMS focused on vibration motion rotation and shock detection It enables MEMS design professionals to create functionally robust and reliable devices utilizing a well established process flow with design rules MicraSilQ supports the production of high volume accelerometer and gyro fabrication in an all in one solution integrating wafer level fabrication hermetic packaging and through silicon via TSV architecture For a MEMS architect designing into a mature process platform with established design rules is the fastest path to a functional device with desired performance commented Alex Edwards vice president of CMC Microsystems The MicraSilQ inertial MEMS platform provides a component that is ready for flip chip integration by providing through silicon vias hermetic wafer level packaging and ball grid array attachment For high attachment reliability the microchip package is completed with lead free solder with specially designed under bump metallization The standard 60 micron device layer allows for the large capacitive comb finger overlap area widely used in inertial sensor designs Custom device layer thicknesses greater or less than 60 microns are also available MicraSilQ moves new sensors from prototype to market with optimum performance device reliability and speed MicraSilQ dramatically lowers costs by eliminating the need for external ceramic housing wirebonds and hermetic sealing on a discrete basis explained Collin Twanow Micralyne s Vice President of Engineering Deposited getter material in the capping wafer provides exceptional Q factor and long term stability Micralyne is showcasing the MicraSilQ Platform and Design Kit in Booth 240 at the Sensors Expo 2015 trade show in Long Beach California June 9 11 2015 To request a copy of the MicraSilQ Design Guide GDSII Design Template and white paper titled Advanced WLP Platform for High Performance MEMS please visit http www micralyne com technology platforms micrasilq About Micralyne

    Original URL path: http://www.micralyne.com/news/a-shorter-road-to-low-cost-advanced-industrial-sensors-is-now-open-with-the-introduction-of-a-silicon-mems-platform/ (2016-04-27)
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  • Micralyne ramps up under New Share Owners | Micralyne
    of development and manufacturing services for micro electro mechanical systems MEMS and micro fabrication in the life sciences telecommunications automotive energy and aerospace industries Micralyne President and CEO Mike Ciprick commented Transitioning from a broad and diverse shareholder base to a focused agile investor team brings us the ownership structure and resources to grow assertively and expand our market share in industrial MEMS sectors FTC Technologies Inc Chairman Ric Forest said This acquisition and our commitment to ongoing investment in Micralyne will leverage the company s leadership engineering expertise and manufacturing capacity for the long term benefit of our customers We were attracted to the sound fundamentals of the company its people and its strategic opportunities MEMS devices are increasingly sophisticated as they enable breakthroughs in medical devices and miniaturized instrumentation Micralyne s fabrication capabilities and experience are well suited to create industry changing product concepts like those in our portfolio commented Dr John Randall President Zyvex Labs LLC We have been very pleased with both the technical skills and professionalism of the Micralyne teams that we work with I believe the new ownership will accelerate Micralyne s ability to meet our needs Micralyne is entering a growth phase with opportunities in MEMS process development and manufacturing expanded Foundry Plus services and the MEMS product sectors Among these the company plans to extend design package and testing capabilities to create more flexible vertically integrated MEMS solutions Micralyne will leverage its new MicraGEM Si TM wafer processing and MicraSilQ TM Wafer Level Packaging methodologies to expand its fabrication of pressure sensors optical switching devices and accelerometers About Micralyne Inc Privatized in 1998 and headquartered in Edmonton Alberta Canada Micralyne s diverse customer base includes innovative Fortune 100 companies and pioneering high tech start ups Micralyne has a proven manufacturing track record

    Original URL path: http://www.micralyne.com/news/micralyne-ramps-up-with-new-ownership/ (2016-04-27)
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  • Building an Advanced Silicon MEMS Chip | Micralyne
    run or who need customization of the technology Our MicraGEM Si platform is ideally suited for the manufacture of tilting mirrors and mirror arrays for variable optical attenuators VOA and wavelength selective switch WSS modules commonly used in fiber optic telecom networks We have been developing and manufacturing this process technology for lead customers for the past three years and now we can offer it widely with a comprehensive design guide through CMC Microsystems said Collin Twanow Micralyne s vice president of sales and marketing The MicraGEM Si platform is a unique offering to our MEMS clients said Alex Edwards vice president of commercial operations for CMC Microsystems This partnership with Micralyne ensures both a seamless path from design confirmation to volume manufacturing for industrial R D and research access for academic inquiry The platform consists of an SOI silicon on insulator base wafer with customer defined cavities support posts and electrical wiring A top SOI wafer with optional cavities is then fusion bonded to the base wafer The handle wafer is removed leaving a precise thickness MEMS device layer A patterned metal layer is added for high reflectivity circuit routing and wire bonding The top side of the wafer can be patterned and etched to release the MEMS devices Micralyne s unique process capability provides high yield wafer bonding after several masks of pattern and etch Alignment tolerance between the bottom layers and the final top silicon layer is within 0 4 microns This allows for complex structures such as staggered vertical comb drive actuators providing low voltage operation and a linear voltage vs tilt response for micro mirrors The design submission deadline for the first build of MicraGEM Si is June 4 2014 Successive campaigns will have design submission deadlines of October 8 2014 and February 17 2015

    Original URL path: http://www.micralyne.com/news/building-an-advanced-silicon-mems-chip-just-became-faster-and-more-affordable/ (2016-04-27)
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